Hybrid/MCM Die Bonder

With its latest Multi-Chip Die Bonder, the 2200 apm+, Datacon meets the newest challenges of many users. The industry proven platform concept and the superior flexibility of the 2200 apm are now available on the 2200 apm+, with the added capability of handling wafers up to 300 mm and die up to 50 mm.
Real Multi Chip Module capability even with non-electric components, SMD´s, Chips, Flip Chip, etc. Free programmable individual component handling/placement data.
Multi Chip capability; Passives, Flip Chip, Die-attach, Non electric components, all in one pass capability; Multi adhesive capability; Tool changer; Needle ejector system; Up to four modules combinable

MCM Die Bonder Service by mcm-die-bonder.com